JPH0244341U - - Google Patents
Info
- Publication number
- JPH0244341U JPH0244341U JP12275788U JP12275788U JPH0244341U JP H0244341 U JPH0244341 U JP H0244341U JP 12275788 U JP12275788 U JP 12275788U JP 12275788 U JP12275788 U JP 12275788U JP H0244341 U JPH0244341 U JP H0244341U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- type semiconductor
- dip type
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275788U JPH0244341U (en]) | 1988-09-21 | 1988-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275788U JPH0244341U (en]) | 1988-09-21 | 1988-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244341U true JPH0244341U (en]) | 1990-03-27 |
Family
ID=31370986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12275788U Pending JPH0244341U (en]) | 1988-09-21 | 1988-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244341U (en]) |
-
1988
- 1988-09-21 JP JP12275788U patent/JPH0244341U/ja active Pending